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產品與技術
WHAT'S FPC
Product Type
Product Application
Service Types
An Introduction to SMT
Production Process
R&D
Product Type
Product Type / Material Availability / Technical Capability / General Tolerances / Roll to Roll Process
Material Availability
(1) Copper Clad Laminate(CCL)
:Standard Material
Item Type Thickness
Base film Polyimide(PI) 1/2 mil
1 mil
2 mil
Polyester(PET)
1 mil
2 mil
-
Copper RA 1/3 oz(12um) 1/2 oz(18um)

1 oz(35um)

ED
adhesiveless CCL
(PI=1 mil)
RA 1/3 oz(12μm) 1/2 oz(18μm) 1 oz(35μm)
ED
 
 
(2) Coverlay(Insulation layer)
Item Type Thickness
Coverlay Polyimide(PI) 1/2 mil 1 mil 2 mil
Polyester(PET) 1/2 mil 1 mil 2 mil
Liquid photoimage
solder mask(LPSM)
   
     
 
 
(3) Stiffener
Item Type Thickness
Adhesive Pressure sensitive(PSA)
Thermosetting(TSA)
Thermocure
Reinforcement board Polyimide(PI) 1, 2, 3, 4, 5, 6, 7, 8, 9 mil
Polyester(PET) white color 1, 2, 3, 4, 5, 7.5 mil
transparent 1, 2, 3, 4, 5, 7.5 mil
black color 7.5 mil
  FR-4

0.1 ~ 2.0 mm

  Aluminum sheet 0.1~1.0mm
  Stainless Steel Plate 0.075~1.0mm
 
 
   
   
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