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SMT Introduction
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The origin of SMT definition

Electronic manufacturing is one of the most important type of information technology industry. For the production and assembly of electronic products, PCBA (printed circuit board assembly) is the most basic and important part. There are commonly the SMT (Surface Mount Technology) and DIP (Dual in -line package) productions.

A pursuing goal in the production of electronic industry is increasing the functional density while reducing the size, i.e., to make the product smaller and lighter. In other words, the purpose is to add more functions to the same size circuit board or to maintain the same function but reduce the surface area. The only way to achieve the goal is to minimize the electronic components, to use them to replace the conventional components. As a result, the SMT is developed.

SMT technology is based on replacing those conventional electronic components by the wafer-type of electronic components and using in-tray for the packaging. At the same time, the conventional approach of drilling and insertion has been replaced by a speedy paste onto the surface of PCB. Moreover, the surface area of PCB has been minimized by developing a multiple layers of boards from a single layer of board.

Advantages from SMT  products
To use SMT for the product is for not only the market demand but also its indirect effect on cost reduction. SMT reduces the cost because of the following:
1. The required surface area and layers for PCB are reduced.
  The required surface area of PCB for carrying the components is relatively reduced because the size of those assembling components has been minimized. Moreover, the material cost for PCB is reduced, and also there is no more processing cost of drilling for the through-holes. It is because the soldering of PCB in the SMD method is direct and flat instead of relying on pins of the components in DIP to pass through the drilled holes in order to be soldered to the PCB. In addition, the PCB layout becomes more effective in the absence of through-holes, and as a consequence, the required layers of PCB are reduced. For example, an originally four layers of a DIP design can be reduced to two layers by the SMD method. It is because when using the SMD method, the two layers of boards will be sufficient for fitting in all the wiring. The cost for two layers of boards is of course less than that of the four layers of boards.
2. SMD is more suitable for a big quantity of production
  The packaging for SMD makes it a better choice for automatic production. Although for those conventional DIP components, there is also an automatic assembling facility, for example, the horizontal type of insertion machine, the vertical type of insertion machine, odd-form insertion machine, and IC inserting machine; nonetheless, the production at each time unit is still less than the SMD. As the production quantity increases for every working time, the unit of production cost is relatively reduced.
3. Fewer operators are required
  Commonly, only about three operators are required per SMT production line, but at least 10 to 20 people are required per DIP line. By reducing the number of people, not only the manpower cost is reduced but also the management becomes easier.
The three production stages of PCBA industry

The production procedures for printed circuit board assembly (PCBA) are:
Components Assembly →Machine (Shell) Assembly → Pilot Run → Product Delivery
For the part of components assembly, it can be further divided into SMT and DIP. The DIP (Dual in-line Package) is what we referred to as the conventional insertion type of operation.

Because the internal structure of the package varies between the components used in SMT and DIP, the appearance of the components differs as well. The assembly process, therefore, has to be changed accordingly. The changes included for the soldering materials, the assembly machine, the assembly approach, etc. Some adjustments and changes have also been done for a series of variables. Those electric components used in the SMT production are also referred to as SMD (surface mount device) or SMC (surface mount component).

Because of the market demand and an increase cost of manpower, the DIP has been quickly replaced by SMT. For those highly portable electronic products, such as mobile phones, PDA, GPS, they are almost 100% produced by the SMT method. As for those products used under high pressure and large current environment, the rate of using SMD is relatively lower because of the characteristics of its components.

For a product that requires both the SMT and DIP components, it usually undergoes the SMT production first and follows by the DIP production. Because an additional production has been included, the production cost will be relatively increased.

 
Flexium's SMT currently has 19 automatic mounting production lines.
The smallest mounting component is the 0201/01005 passive components production. The 0.3mm pitch connector component and BGA/CSP active components
 
 
   
   
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